National Repository of Grey Literature 6 records found  Search took 0.01 seconds. 
BGA Packages - Deassembly and Assembly with Different Heat Transfer Equipments Application
Dundr, Jakub ; Špinka, Jiří (referee) ; Starý, Jiří (advisor)
This bachelor thesis is focused on problematics of packaging, BGA package construction and following rework procedures that can be chosen for this packages. This thesis further includes explanation of physical principles of heat transfer. Last but not least particular rework stations for BGA rework with their specifications are being compared in this bachelor thesis.
Methods of printed circuit board design
Cirkovský, Jaroslav ; Vrba, Kamil (referee) ; Herencsár, Norbert (advisor)
The main purpose of my bachelor thesis was to acquaint with issues of printed circuit boards and to create multimedia videos. The first part deals with questions of the accuracy, miniaturization and applied cases with different outlets. Following chapters dissert on electromagnetic compatibility from the view of basic rules, which have to be observed in order to reach the best functionality of the printed circuit board. There are also other issues - components increasing the reliability of printed circuit board and the comparing of methods of printed circuit board design. The final part of my bachelor thesis discusses outputs which are necessary in practice. This includes technical and design documentation and the technology of production the printed circuit. The last chapter describes created multimedia utilities which help us with printed circuit boards design via the program Eagle.
Design and realisation of solder-ball mounting device
Bobek, Josef ; Szendiuch, Ivan (referee) ; Nicák, Michal (advisor)
This work deals with issues of design and construction of facilities for mounting solder balls. The first part includes a familiarization with the types, manufacture and assembly of solder balls in practice. The following section includes the actual construction work on the equipment, procedures, considerations and finish work on the plant. The last part provides information about solder balls testing, which are mounted on the FRITSCH station, and compares potential errors.
BGA Packages - Deassembly and Assembly with Different Heat Transfer Equipments Application
Dundr, Jakub ; Špinka, Jiří (referee) ; Starý, Jiří (advisor)
This bachelor thesis is focused on problematics of packaging, BGA package construction and following rework procedures that can be chosen for this packages. This thesis further includes explanation of physical principles of heat transfer. Last but not least particular rework stations for BGA rework with their specifications are being compared in this bachelor thesis.
Design and realisation of solder-ball mounting device
Bobek, Josef ; Szendiuch, Ivan (referee) ; Nicák, Michal (advisor)
This work deals with issues of design and construction of facilities for mounting solder balls. The first part includes a familiarization with the types, manufacture and assembly of solder balls in practice. The following section includes the actual construction work on the equipment, procedures, considerations and finish work on the plant. The last part provides information about solder balls testing, which are mounted on the FRITSCH station, and compares potential errors.
Methods of printed circuit board design
Cirkovský, Jaroslav ; Vrba, Kamil (referee) ; Herencsár, Norbert (advisor)
The main purpose of my bachelor thesis was to acquaint with issues of printed circuit boards and to create multimedia videos. The first part deals with questions of the accuracy, miniaturization and applied cases with different outlets. Following chapters dissert on electromagnetic compatibility from the view of basic rules, which have to be observed in order to reach the best functionality of the printed circuit board. There are also other issues - components increasing the reliability of printed circuit board and the comparing of methods of printed circuit board design. The final part of my bachelor thesis discusses outputs which are necessary in practice. This includes technical and design documentation and the technology of production the printed circuit. The last chapter describes created multimedia utilities which help us with printed circuit boards design via the program Eagle.

Interested in being notified about new results for this query?
Subscribe to the RSS feed.